Advanced semiconductor packaging design via artificial intelligence and machine learning: A review
M. Rafiee; P. Saini
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Microelectronics Reliability
- Research area
- AI & compute
- Source type
- Journal article
- DOI
- 10.1016/j.microrel.2026.116145
The original publisher provides the full text and its access options.
Cite this source
M. Rafiee; P. Saini. Advanced semiconductor packaging design via artificial intelligence and machine learning: A review. Microelectronics Reliability. 2026-06. https://doi.org/10.1016/j.microrel.2026.116145