A theoretical approach to warpage in semiconductor applications with high computational efficiency
Yongha Kim; Seungjun Ryu
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Engineering Analysis with Boundary Elements
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.enganabound.2025.106432
The original publisher provides the full text and its access options.
Cite this source
Yongha Kim; Seungjun Ryu. A theoretical approach to warpage in semiconductor applications with high computational efficiency. Engineering Analysis with Boundary Elements. 2025-10. https://doi.org/10.1016/j.enganabound.2025.106432