Research progress on semiconductor junction temperature thermal testing and thermal digital twin technology
Yin Wei; Haichao Feng; Yuefeng Li; Dezhi Jin; Aijun Zhou; Junkai Yao; Jun Zou; Hao Zheng
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Measurement
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.measurement.2025.118504
The original publisher provides the full text and its access options.
Cite this source
Yin Wei; Haichao Feng; Yuefeng Li; Dezhi Jin; Aijun Zhou; Junkai Yao; Jun Zou; Hao Zheng. Research progress on semiconductor junction temperature thermal testing and thermal digital twin technology. Measurement. 2026-01. https://doi.org/10.1016/j.measurement.2025.118504