Strength and Reliability of Adhesive-Bonded Joints in Semiconductor Packaging: A Computational Analysis
Shah Mohammad Azam Rishad; Md Shahidul Islam; Md. Ashraful Islam
- Published
- Publisher
- Universiti Malaysia Pahang Al-Sultan Abdullah Press (UMPSA Press)
- Journal / collection
- International Journal of Automotive and Mechanical Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.15282/ijame.22.2.2025.17.0954
The original publisher provides the full text and its access options.
Cite this source
Shah Mohammad Azam Rishad; Md Shahidul Islam; Md. Ashraful Islam. Strength and Reliability of Adhesive-Bonded Joints in Semiconductor Packaging: A Computational Analysis. International Journal of Automotive and Mechanical Engineering. 2025-06-27. https://doi.org/10.15282/ijame.22.2.2025.17.0954