Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging
Wei-Cheng Chao; Chia-Pei Chu; Ying-Chih Liao
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Composites Part A: Applied Science and Manufacturing
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.compositesa.2025.108757
The original publisher provides the full text and its access options.
Cite this source
Wei-Cheng Chao; Chia-Pei Chu; Ying-Chih Liao. Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging. Composites Part A: Applied Science and Manufacturing. 2025-05. https://doi.org/10.1016/j.compositesa.2025.108757