Materials and Evaluation Methodology of Pogo Pin for Semiconductor Package Testing
Mi-Song Kim; Won Sik Hong; Yong-Jun Kim; Chi-Hun In; Jeong Tak Moon
- Published
- Publisher
- The Korean Welding and Joining Society
- Journal / collection
- Journal of Welding and Joining
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.5781/jwj.2025.43.2.3
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Cite this source
Mi-Song Kim; Won Sik Hong; Yong-Jun Kim; Chi-Hun In; Jeong Tak Moon. Materials and Evaluation Methodology of Pogo Pin for Semiconductor Package Testing. Journal of Welding and Joining. 2025-04-30. https://doi.org/10.5781/jwj.2025.43.2.3