Backside Decapsulation of Small Outline Transistor (SOT) Packages Through Milling Techniques
John Michael Saputil; Edgardo Bilog
- Published
- Publisher
- ASM International
- Journal / collection
- International Symposium for Testing and Failure Analysis
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.31399/asm.cp.istfa2025p0443
The original publisher provides the full text and its access options.
Cite this source
John Michael Saputil; Edgardo Bilog. Backside Decapsulation of Small Outline Transistor (SOT) Packages Through Milling Techniques. International Symposium for Testing and Failure Analysis. 2025-11-16. https://doi.org/10.31399/asm.cp.istfa2025p0443