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Research literature / Conference paper

Enhancement of Micro-DIC Technique and Deformation Measurement of Fine-Pitch Semiconductor Packages

Hyunwoo Nam; Seongkyu Choi; Minjeong Sohn; Tae Yeob Kang; Tae-Ik Lee

Published
Publisher
IEEE
Journal / collection
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)
Research area
Semiconductors
Source type
Conference paper
DOI
10.23919/icep-hbs69241.2026.11550561

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Hyunwoo Nam; Seongkyu Choi; Minjeong Sohn; Tae Yeob Kang; Tae-Ik Lee. Enhancement of Micro-DIC Technique and Deformation Measurement of Fine-Pitch Semiconductor Packages. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS). 2026-04-14. https://doi.org/10.23919/icep-hbs69241.2026.11550561

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