Anti-Counterfeit Semiconductor Package Using a Unique Identification Mark
Ken Takano; Tadatomo Yamada; Toshiaki Menjo; Sayaka Matsuno; Shinya Takyu; Naoki Yoshida; Iwaki Miyamoto; Tsutomu Mastumoto
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/empc63132.2025.11222504
The original publisher provides the full text and its access options.
Cite this source
Ken Takano; Tadatomo Yamada; Toshiaki Menjo; Sayaka Matsuno; Shinya Takyu; Naoki Yoshida; Iwaki Miyamoto; Tsutomu Mastumoto. Anti-Counterfeit Semiconductor Package Using a Unique Identification Mark. 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC). 2025-09-15. https://doi.org/10.23919/empc63132.2025.11222504