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Research literature / Conference paper

Crack Growth Modelling in Semiconductor Package Materials by Digital Image Correlation and Finite Element Methods

Brinda George; Georg M. Reuther; Ingolf Rau; Bernhard Wunderle

Published
Publisher
IEEE
Journal / collection
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/eurosime65125.2025.11006618

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Brinda George; Georg M. Reuther; Ingolf Rau; Bernhard Wunderle. Crack Growth Modelling in Semiconductor Package Materials by Digital Image Correlation and Finite Element Methods. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). 2025-04-06. https://doi.org/10.1109/eurosime65125.2025.11006618

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