Skip to content
Independent research & intelligence
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Conference paper

Mechanism Analysis of DFB Semiconductor Laser Chip Spectral Degradation

Yilong Wu; Weiwei Xiang; Yong Liu; Xiaomeng Lv; Yaru Li; Jiaming Zhang; Mingxiao Zhao; Hai Jiang; Weihua Xu; Can Huang

Published
Publisher
IEEE
Journal / collection
2026 27th International Conference on Electronic Packaging Technology (ICEPT)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/icept71373.2026.11689992

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Yilong Wu; Weiwei Xiang; Yong Liu; Xiaomeng Lv; Yaru Li; Jiaming Zhang; Mingxiao Zhao; Hai Jiang; Weihua Xu; Can Huang. Mechanism Analysis of DFB Semiconductor Laser Chip Spectral Degradation. 2026 27th International Conference on Electronic Packaging Technology (ICEPT). 2026-08. https://doi.org/10.1109/icept71373.2026.11689992

Download RIS