Research on precision machining technology of semiconductor testing equipment parts
Weiwen Ye; Bingchun Jiang; Jing Feng; Xianzhou Hou
- Published
- Publisher
- SPIE
- Journal / collection
- Third International Conference on Advanced Materials and Equipment Manufacturing (AMEM 2024)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1117/12.3069422
The original publisher provides the full text and its access options.
Cite this source
Weiwen Ye; Bingchun Jiang; Jing Feng; Xianzhou Hou. Research on precision machining technology of semiconductor testing equipment parts. Third International Conference on Advanced Materials and Equipment Manufacturing (AMEM 2024). 2025-07-08. https://doi.org/10.1117/12.3069422