Malaysia's Shift in Packaging and Testing: Impact on China's Semiconductor Supply Chain Disruption and Response Strategies
Shi Tianyao
- Published
- Publisher
- Science Publishing Group
- Journal / collection
- Science Innovation
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.11648/j.si.20261405.14
The original publisher provides the full text and its access options.
Cite this source
Shi Tianyao. Malaysia's Shift in Packaging and Testing: Impact on China's Semiconductor Supply Chain Disruption and Response Strategies. Science Innovation. 2026-09-04. https://doi.org/10.11648/j.si.20261405.14