Sustainable production scheduling during machine deterioration in wire bonding process of semiconductor assembly
Yi-Chun Peng; Jo-Chi Chao; Kuan-Wei He; Ping-Chien Chen
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- The International Journal of Advanced Manufacturing Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s00170-026-17721-6
The original publisher provides the full text and its access options.
Cite this source
Yi-Chun Peng; Jo-Chi Chao; Kuan-Wei He; Ping-Chien Chen. Sustainable production scheduling during machine deterioration in wire bonding process of semiconductor assembly. The International Journal of Advanced Manufacturing Technology. 2026-02-19. https://doi.org/10.1007/s00170-026-17721-6