A Review of Through-Silicon Via Inspection and Metrology Technology for Advanced Semiconductor Packaging
Kuan Lu; Pengfei Lin; Heebum Chun; Byunggi Kim; Masahiro Nomura; Jiyong Park; ChaBum Lee
- Published
- Publisher
- ASME International
- Journal / collection
- Journal of Manufacturing Science and Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1115/1.4069965
The original publisher provides the full text and its access options.
Cite this source
Kuan Lu; Pengfei Lin; Heebum Chun; Byunggi Kim; Masahiro Nomura; Jiyong Park; ChaBum Lee. A Review of Through-Silicon Via Inspection and Metrology Technology for Advanced Semiconductor Packaging. Journal of Manufacturing Science and Engineering. 2025-11-07. https://doi.org/10.1115/1.4069965