Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging
Han Jiang; Yaohua Xu; Saranarayanan Ramachandran; Shuibao Liang
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Microelectronics Reliability
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.microrel.2025.115864
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Cite this source
Han Jiang; Yaohua Xu; Saranarayanan Ramachandran; Shuibao Liang. Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging. Microelectronics Reliability. 2025-10. https://doi.org/10.1016/j.microrel.2025.115864