RDL-First FOWLP Development for III-V Semiconductor Chips in RF Applications
Soon Wee Ho; Soh Siew Boon; Hsiao Hsiang-Yao; Eva Wai Leong Ching; Xu Feng; Lim Teck Guan; Vempati Srinivasa Rao
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/eptc67330.2025.11392664
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Cite this source
Soon Wee Ho; Soh Siew Boon; Hsiao Hsiang-Yao; Eva Wai Leong Ching; Xu Feng; Lim Teck Guan; Vempati Srinivasa Rao. RDL-First FOWLP Development for III-V Semiconductor Chips in RF Applications. 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). 2025-12-02. https://doi.org/10.1109/eptc67330.2025.11392664