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Research literature / Conference paper

Scanning Electron Microscopy for Advanced Semiconductor Packaging: From Sample Preparation to Characterization and Failure Analysis

Pawel Nowakowski

Published
Publisher
ASM International
Journal / collection
International Symposium for Testing and Failure Analysis
Research area
Semiconductors
Source type
Conference paper
DOI
10.31399/asm.cp.istfa2025tp00n1

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Pawel Nowakowski. Scanning Electron Microscopy for Advanced Semiconductor Packaging: From Sample Preparation to Characterization and Failure Analysis. International Symposium for Testing and Failure Analysis. 2025-11-16. https://doi.org/10.31399/asm.cp.istfa2025tp00n1

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