Analysis of multi-field coupling behaviors of sandwich piezoelectric semiconductor beams under thermal loadings
Dejuan Kong; Zhuangzhuang He; Chengbin Liu; Chunli Zhang
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Applied Mathematics and Mechanics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s10483-025-3284-7
The original publisher provides the full text and its access options.
Cite this source
Dejuan Kong; Zhuangzhuang He; Chengbin Liu; Chunli Zhang. Analysis of multi-field coupling behaviors of sandwich piezoelectric semiconductor beams under thermal loadings. Applied Mathematics and Mechanics. 2025-07-29. https://doi.org/10.1007/s10483-025-3284-7