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Research literature / Conference paper

Power Variation Analysis During Transient Thermal Measurement of Semiconductor Packages

Shuhei Fukunaga; Tomoaki Hara; Tsuyoshi Funaki

Published
Publisher
IEEE
Journal / collection
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.23919/icep-iaac64884.2025.11003002

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Shuhei Fukunaga; Tomoaki Hara; Tsuyoshi Funaki. Power Variation Analysis During Transient Thermal Measurement of Semiconductor Packages. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2025-04-15. https://doi.org/10.23919/icep-iaac64884.2025.11003002

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