Investigation of Laser Debonding Using a 308 nm Excimer Laser for Advanced Semiconductor Packaging
- Published
- Publisher
- Japan Laser Processing Society
- Journal / collection
- Journal of Laser Micro/Nanoengineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.2961/jlmn.2026.02.2010
The original publisher provides the full text and its access options.
Cite this source
Japan Laser Processing Society. Investigation of Laser Debonding Using a 308 nm Excimer Laser for Advanced Semiconductor Packaging. Journal of Laser Micro/Nanoengineering. 2026-08. https://doi.org/10.2961/jlmn.2026.02.2010