On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages
Sukrut Prashant Phansalkar; Yongrae Jang; Bongtae Han
- Published
- Publisher
- ASME International
- Journal / collection
- Journal of Electronic Packaging
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1115/1.4068884
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Cite this source
Sukrut Prashant Phansalkar; Yongrae Jang; Bongtae Han. On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages. Journal of Electronic Packaging. 2025-06-20. https://doi.org/10.1115/1.4068884