Transistor-to-Package Thermal Simulation with Hotspot Mitigation by Decoupling
Tao Chou; Hsin-Cheng Lin; Ching-Wang Yao; Yu-Sheng Lai; Fang-Yu Chang; Chia-Wei Tseng; Tzu-An Chang; He-Wen Shen; C. W. Liu
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE International Electron Devices Meeting (IEDM)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/iedm50572.2025.11353735
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Cite this source
Tao Chou; Hsin-Cheng Lin; Ching-Wang Yao; Yu-Sheng Lai; Fang-Yu Chang; Chia-Wei Tseng; Tzu-An Chang; He-Wen Shen; C. W. Liu. Transistor-to-Package Thermal Simulation with Hotspot Mitigation by Decoupling. 2025 IEEE International Electron Devices Meeting (IEDM). 2025-12-06. https://doi.org/10.1109/iedm50572.2025.11353735