Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientation
JaeJun Yoon; TaekSoo Shin; DongJin Kim; KunSang Park; DongKeun Na; Yeonju Go; SeungBoo Jung
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Scientific Reports
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1038/s41598-026-38879-9
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Cite this source
JaeJun Yoon; TaekSoo Shin; DongJin Kim; KunSang Park; DongKeun Na; Yeonju Go; SeungBoo Jung. Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientation. Scientific Reports. 2026-02-19. https://doi.org/10.1038/s41598-026-38879-9