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Research literature / Conference paper

Low-Roughness UV Laser Drilling for Sub-10 μm Vias in Advanced Semiconductor Package Substrates

Namson Park; Tae-Young Lee; Dongbae Park; Minsu Jo; Sungyong Kim; Sehoon Yoo; Munsang You; Geonhee Lee; Kyoungmin Kim

Published
Publisher
IEEE
Journal / collection
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/impact67645.2025.11281793

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Namson Park; Tae-Young Lee; Dongbae Park; Minsu Jo; Sungyong Kim; Sehoon Yoo; Munsang You; Geonhee Lee; Kyoungmin Kim. Low-Roughness UV Laser Drilling for Sub-10 μm Vias in Advanced Semiconductor Package Substrates. 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). 2025-10-21. https://doi.org/10.1109/impact67645.2025.11281793

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