Semiconductor Wafer Warpage in Electronics Packaging: A Hybrid Investigation with ML and Experimental Insights
krishnamoorthy Ramalingam; Mohd Zulkifly Abdullah; Mohamad Aizat Abas; Kok Hwa Yu; Roslan Kamarudin; Muhammad Raz Abdul Rahman; Shaw Fong Wong; Pooi Kit Lam; Bok Eng Cheah
- Published
- Publisher
- Springer Science and Business Media LLC
- Research area
- Semiconductors
- Source type
- Preprint / posted paper
- DOI
- 10.21203/rs.3.rs-6728862/v1
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Cite this source
krishnamoorthy Ramalingam; Mohd Zulkifly Abdullah; Mohamad Aizat Abas; Kok Hwa Yu; Roslan Kamarudin; Muhammad Raz Abdul Rahman; Shaw Fong Wong; Pooi Kit Lam; Bok Eng Cheah. Semiconductor Wafer Warpage in Electronics Packaging: A Hybrid Investigation with ML and Experimental Insights. Springer Science and Business Media LLC. 2025-06-06. https://doi.org/10.21203/rs.3.rs-6728862/v1