Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging
Chungen Hsu; Chenlei Pang; Qinghua Lu; Seongku Kim
- Published
- Publisher
- American Chemical Society (ACS)
- Journal / collection
- ACS Applied Materials & Interfaces
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1021/acsami.6c09651
The original publisher provides the full text and its access options.
Cite this source
Chungen Hsu; Chenlei Pang; Qinghua Lu; Seongku Kim. Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging. ACS Applied Materials & Interfaces. 2026-08-07. https://doi.org/10.1021/acsami.6c09651