Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging
Pradeep Lall; Padmanava Choudhury; Aathi Pandurangan
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/empc63132.2025.11222417
The original publisher provides the full text and its access options.
Cite this source
Pradeep Lall; Padmanava Choudhury; Aathi Pandurangan. Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging. 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC). 2025-09-15. https://doi.org/10.23919/empc63132.2025.11222417