Optimization mechanism of laminated ceramic package structure on the regulation of semiconductor cooling performance
Shifeng Yan; Qian Zhao; Faxiang Wang; Yurun Bai; Tianxiang Liu; Wenzhong Guo; Changfu Zhang
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Scientific Reports
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1038/s41598-025-98104-x
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Cite this source
Shifeng Yan; Qian Zhao; Faxiang Wang; Yurun Bai; Tianxiang Liu; Wenzhong Guo; Changfu Zhang. Optimization mechanism of laminated ceramic package structure on the regulation of semiconductor cooling performance. Scientific Reports. 2025-04-26. https://doi.org/10.1038/s41598-025-98104-x