Future interconnect materials for highly integrated semiconductor devices
Hyeongjoon Kim; Sehun Oh; Sihyeon An; Jaewon Kim; Taehoon Kim; Seohyun Jeong; Onurcan Kaya; Thomas Galvani; Stephan Roche; Judy J. Cha; Manish Chhowalla; Hyeon Suk Shin; Hyeon-Jin Shin
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Nature Reviews Electrical Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1038/s44287-025-00233-y
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Hyeongjoon Kim; Sehun Oh; Sihyeon An; Jaewon Kim; Taehoon Kim; Seohyun Jeong; Onurcan Kaya; Thomas Galvani; Stephan Roche; Judy J. Cha; Manish Chhowalla; Hyeon Suk Shin; Hyeon-Jin Shin. Future interconnect materials for highly integrated semiconductor devices. Nature Reviews Electrical Engineering. 2025-11-24. https://doi.org/10.1038/s44287-025-00233-y