Laser-Assisted Bonding with h-BN Filled Non-Conductive Film for Fine-Pitch Semiconductor Packaging
Seong-Cheol Kim; Jiho Joo; Yong-Sung Eom; Gwang-Mun Choi; Jungho Shin; Ki-Seok Jang; Jin-Hyuk Oh; Chanmi Lee; Gaeun Lee; Miri Yoon; Seung-Yoon Lee; Kwang-Seong Choi
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ectc51846.2026.00331
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Cite this source
Seong-Cheol Kim; Jiho Joo; Yong-Sung Eom; Gwang-Mun Choi; Jungho Shin; Ki-Seok Jang; Jin-Hyuk Oh; Chanmi Lee; Gaeun Lee; Miri Yoon; Seung-Yoon Lee; Kwang-Seong Choi. Laser-Assisted Bonding with h-BN Filled Non-Conductive Film for Fine-Pitch Semiconductor Packaging. 2026 IEEE 76th Electronic Components and Technology Conference (ECTC). 2026-05-26. https://doi.org/10.1109/ectc51846.2026.00331