Micro-Defect Inspection on Semiconductor Packages Using Pulsed Laser Thermography
Doyun Kim; Jaehyun Lim; Taekkyun Kim; Nguyen Xuan Bang; Daehee Kim; Joong Bae Kim; Jinsung Rho
- Published
- Publisher
- Elsevier BV
- Research area
- Semiconductors
- Source type
- Preprint / posted paper
- DOI
- 10.2139/ssrn.7355708
This is a preprint or other posted paper. Check the original source for its review and publication status.
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Cite this source
Doyun Kim; Jaehyun Lim; Taekkyun Kim; Nguyen Xuan Bang; Daehee Kim; Joong Bae Kim; Jinsung Rho. Micro-Defect Inspection on Semiconductor Packages Using Pulsed Laser Thermography. Elsevier BV. 2026. https://doi.org/10.2139/ssrn.7355708