Alliance bundling, relative technological capability, and semiconductor governance modes: explaining U.S. technology governance toward Japan and China
Xinping Huang
- Published
- Publisher
- Frontiers Media SA
- Journal / collection
- Frontiers in Political Science
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.3389/fpos.2026.1794223
The original publisher provides the full text and its access options.
Cite this source
Xinping Huang. Alliance bundling, relative technological capability, and semiconductor governance modes: explaining U.S. technology governance toward Japan and China. Frontiers in Political Science. 2026-07-21. https://doi.org/10.3389/fpos.2026.1794223