A Hybrid Thermal Network Model for Evaluating the Junction Temperature of Power Semiconductor Devices
Xin Wang; Yingzhou Peng; Wen Huang; Kaichun Wang; Zhikang Shuai
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE Energy Conversion Conference Congress and Exposition (ECCE)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ecce58356.2025.11259934
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Cite this source
Xin Wang; Yingzhou Peng; Wen Huang; Kaichun Wang; Zhikang Shuai. A Hybrid Thermal Network Model for Evaluating the Junction Temperature of Power Semiconductor Devices. 2025 IEEE Energy Conversion Conference Congress and Exposition (ECCE). 2025-10-19. https://doi.org/10.1109/ecce58356.2025.11259934