Packaging Design and Characterization of a 16-Channel Silicon Photonic Transmitter Module for a 1.6 Tb/s-Class Optical Engine
Fu-Hsiang Hsu; Wei-Chih Cheng; Chien-Wei Huang; Hong-Wei Huang; Chia-Chin Chiang; Chun-Nien Liu
- Published
- Publisher
- MDPI AG
- Journal / collection
- Microelectronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.3390/microelectronics2030014
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Cite this source
Fu-Hsiang Hsu; Wei-Chih Cheng; Chien-Wei Huang; Hong-Wei Huang; Chia-Chin Chiang; Chun-Nien Liu. Packaging Design and Characterization of a 16-Channel Silicon Photonic Transmitter Module for a 1.6 Tb/s-Class Optical Engine. Microelectronics. 2026-09-17. https://doi.org/10.3390/microelectronics2030014