Digital Twin for Developing and Verifying Semiconductor Packaging License Models
Lai-Chung Lee; Shou-Yen Zhao; Whei-Jane Wei
- Published
- Publisher
- MDPI
- Journal / collection
- 2024 IEEE 7th International Conference on Knowledge Innovation and Invention
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.3390/engproc2025089045
The original publisher provides the full text and its access options.
Cite this source
Lai-Chung Lee; Shou-Yen Zhao; Whei-Jane Wei. Digital Twin for Developing and Verifying Semiconductor Packaging License Models. 2024 IEEE 7th International Conference on Knowledge Innovation and Invention. 2025-04-15. https://doi.org/10.3390/engproc2025089045