Skip to content
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Conference paper

Application of Indium Sheet Thermal Interface Material in Advanced Semiconductor Packaging

Wen-Yu Teng; Leon Li; Debby Li; Terry Hou; Liang Yih Hung; Andrew Kang; Don Son Jiang; Yu-Po Wang; Lewis Huang

Published
Publisher
IEEE
Journal / collection
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.23919/icep-iaac64884.2025.11002901

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Wen-Yu Teng; Leon Li; Debby Li; Terry Hou; Liang Yih Hung; Andrew Kang; Don Son Jiang; Yu-Po Wang; Lewis Huang. Application of Indium Sheet Thermal Interface Material in Advanced Semiconductor Packaging. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2025-04-15. https://doi.org/10.23919/icep-iaac64884.2025.11002901

Download RIS