Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center
Hussam Amrouch; Jehaan Joseph; Michael Schirmer; Johannes Geier; Ulf Schlichtmann; Michael Meidinger; Thomas Wild; Andreas Herkersdorf; Jens Nöpel; Georg Sigl; Yicheng Zhang; Carsten Trinitis; Aswathy Nedumpalli Sankaranarayanan; Martin Schulz; Andreas Korb; Konrad Hohentanner
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 Design, Automation & Test in Europe Conference (DATE)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/date69613.2026.11539406
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Cite this source
Hussam Amrouch; Jehaan Joseph; Michael Schirmer; Johannes Geier; Ulf Schlichtmann; Michael Meidinger; Thomas Wild; Andreas Herkersdorf; Jens Nöpel; Georg Sigl; Yicheng Zhang; Carsten Trinitis; Aswathy Nedumpalli Sankaranarayanan; Martin Schulz; Andreas Korb; Konrad Hohentanner. Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center. 2026 Design, Automation & Test in Europe Conference (DATE). 2026-04-20. https://doi.org/10.23919/date69613.2026.11539406