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Research literature / Conference paper

Analysis of Thermal Characteristics According to Semiconductor Package Structure and Application

Youngsang Cho; Wonsik Shin; Moonseob Jeong; Junso Pak; Seungwook Yoon; Ilryong Kim

Published
Publisher
IEEE
Journal / collection
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/itherm55376.2025.11235682

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Youngsang Cho; Wonsik Shin; Moonseob Jeong; Junso Pak; Seungwook Yoon; Ilryong Kim. Analysis of Thermal Characteristics According to Semiconductor Package Structure and Application. 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). 2025-05-27. https://doi.org/10.1109/itherm55376.2025.11235682

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