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Research literature / Journal article

Direct joining of hot water-treated copper and epoxy resin for improvement of semiconductor packaging

Ryuichiro Hanada; Weiyan Chen; Fuminobu Kimura; Yusuke Kajihara

Published
Publisher
Elsevier BV
Journal / collection
Procedia CIRP
Research area
Semiconductors
Source type
Journal article
DOI
10.1016/j.procir.2026.03.005

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Ryuichiro Hanada; Weiyan Chen; Fuminobu Kimura; Yusuke Kajihara. Direct joining of hot water-treated copper and epoxy resin for improvement of semiconductor packaging. Procedia CIRP. 2026. https://doi.org/10.1016/j.procir.2026.03.005

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