A Comparative Review of Junction Temperature Monitoring for SiC-Based Power Semiconductor Devices
Guangjie Zhu; Xiangshun Li; Song Xiong; Cheng Wang
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Device and Materials Reliability
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tdmr.2026.3689949
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Cite this source
Guangjie Zhu; Xiangshun Li; Song Xiong; Cheng Wang. A Comparative Review of Junction Temperature Monitoring for SiC-Based Power Semiconductor Devices. IEEE Transactions on Device and Materials Reliability. 2026-06. https://doi.org/10.1109/tdmr.2026.3689949