Synergistic Additive Formulation and Electrochemical Analysis for Copper Grain Refinement in Advanced Semiconductor Packaging
Rui-Zhe Wu; Tzu-Hsing Chiang; Shu-Ting Mai; Chien-Yu Huang; Chen-Chao Wang; Chin-Pin Hung
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 27th International Conference on Electronic Packaging Technology (ICEPT)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/icept71373.2026.11690398
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Cite this source
Rui-Zhe Wu; Tzu-Hsing Chiang; Shu-Ting Mai; Chien-Yu Huang; Chen-Chao Wang; Chin-Pin Hung. Synergistic Additive Formulation and Electrochemical Analysis for Copper Grain Refinement in Advanced Semiconductor Packaging. 2026 27th International Conference on Electronic Packaging Technology (ICEPT). 2026-08. https://doi.org/10.1109/icept71373.2026.11690398