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Research literature / Preprint / posted paper

Microstructural Evolution and High-Temperature Reliability of AgNW/AgNF Nanocomposite Films for Semiconductor Packaging Interconnects

Yan Long; Jiaxuan Zhou; Dongyang Zhuang; Naiqian Wang; Tao Peng; Fengya Liu

Published
Publisher
Elsevier BV
Research area
Semiconductors
Source type
Preprint / posted paper
DOI
10.2139/ssrn.7467364

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Yan Long; Jiaxuan Zhou; Dongyang Zhuang; Naiqian Wang; Tao Peng; Fengya Liu. Microstructural Evolution and High-Temperature Reliability of AgNW/AgNF Nanocomposite Films for Semiconductor Packaging Interconnects. Elsevier BV. 2026. https://doi.org/10.2139/ssrn.7467364

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