Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Ryota Yambe; Shunsuke Kurahashi; Rimpei Kindaichi; Keita Johno; Kosuke Murai; Yuichi Yanaka; Takashi Masuko; Kosuke Urashima
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/edaps66187.2025.11411742
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Cite this source
Ryota Yambe; Shunsuke Kurahashi; Rimpei Kindaichi; Keita Johno; Kosuke Murai; Yuichi Yanaka; Takashi Masuko; Kosuke Urashima. Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage. 2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). 2025-12-15. https://doi.org/10.1109/edaps66187.2025.11411742