Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks
Cai Ren; Kaifa Wang; Baolin Wang
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Applied Mathematics and Mechanics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s10483-026-3343-6
The original publisher provides the full text and its access options.
Cite this source
Cai Ren; Kaifa Wang; Baolin Wang. Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks. Applied Mathematics and Mechanics. 2026-02. https://doi.org/10.1007/s10483-026-3343-6