Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior Connectivity
Sung Jin Kim
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.147809
The original publisher provides the full text and its access options.
Cite this source
Sung Jin Kim. Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior Connectivity. IMAPSource Proceedings. 2025-11-19. https://doi.org/10.4071/001c.147809