Thermal Performance of Hybrid Liquid Cooling for Data Center
Chun-Kai Liu; Chun-Hsien Huang; Hsieh-Chun Hsieh
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
- Research area
- AI & compute
- Source type
- Conference paper
- DOI
- 10.1109/impact67645.2025.11281724
The original publisher provides the full text and its access options.
Cite this source
Chun-Kai Liu; Chun-Hsien Huang; Hsieh-Chun Hsieh. Thermal Performance of Hybrid Liquid Cooling for Data Center. 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). 2025-10-21. https://doi.org/10.1109/impact67645.2025.11281724