Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging
Taejoon Noh; Eun-Chae Noh; Minjae Sung; Jaejun Yoon; Ho-Kyeong Seong; Dong-Gil Kang; Jeong-Won Yoon; Seung-Boo Jung
- Published
- Publisher
- American Chemical Society (ACS)
- Journal / collection
- ACS Omega
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1021/acsomega.5c08402
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Cite this source
Taejoon Noh; Eun-Chae Noh; Minjae Sung; Jaejun Yoon; Ho-Kyeong Seong; Dong-Gil Kang; Jeong-Won Yoon; Seung-Boo Jung. Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging. ACS Omega. 2025-11-08. https://doi.org/10.1021/acsomega.5c08402