Monolithic Si-Micropillar Loop Heat Pipe with 250 µm Thickness for High-Heat-Flux Semiconductor Cooling
Ai Ueno; Ryobu Nomura; Masaaki Hashimoto; Madoka Kurosaki; Munehiro Tada; Hosei Nagano
- Published
- Publisher
- Springer Science and Business Media LLC
- Research area
- Semiconductors
- Source type
- Preprint / posted paper
- DOI
- 10.21203/rs.3.rs-8551966/v1
This is a preprint or other posted paper. Check the original source for its review and publication status.
The original publisher provides the full text and its access options.
Cite this source
Ai Ueno; Ryobu Nomura; Masaaki Hashimoto; Madoka Kurosaki; Munehiro Tada; Hosei Nagano. Monolithic Si-Micropillar Loop Heat Pipe with 250 µm Thickness for High-Heat-Flux Semiconductor Cooling. Springer Science and Business Media LLC. 2026-01-20. https://doi.org/10.21203/rs.3.rs-8551966/v1