Metal–Polymer Hybrid Bonding for Contamination Mitigation in Polymer-Based Semiconductor Packaging
Dong Yun Sung; Jiyun Lee; Seoyeon Choi; Seul Ki Hong
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ectc51846.2026.00364
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Cite this source
Dong Yun Sung; Jiyun Lee; Seoyeon Choi; Seul Ki Hong. Metal–Polymer Hybrid Bonding for Contamination Mitigation in Polymer-Based Semiconductor Packaging. 2026 IEEE 76th Electronic Components and Technology Conference (ECTC). 2026-05-26. https://doi.org/10.1109/ectc51846.2026.00364